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Ruggedized Solutions

Advantech offers comprehensive system integration, hardware, software, customer-centric design services, and global logistics support; all backed by industry-leading front and back office e-business solutions. We cooperate closely with our partners to help provide complete solutions for a wide array of applications across a diverse range of industries.


Advantech has always been an innovator in the development and manufacturing of high-quality, highperformance computing platforms, and our mission is to empower these innovations by offering trustworthy ePlatform products and services. As a smart system integrator, knowing how to differentiate applications with faster solutions is the most important point.

Advantech COM Express Compact Modules APC Smartwave

In a dynamic market, technical specifications keep changing. However, Computer On Modules can help you to reduce the time and work involved with designing new carrier boards. Advantech seamlessly supports you in handling the complexities of technical research at each development stage, which greatly minimizes development times. When we stand by you, you can concentrate on your core competence. With Advantech, there is no limit to the applications and innovations Advantech SOM-6896 Intel USB 3.0 products make possible.

For more information, visit: Since the COM architecture provides various standard specifications in different form factors and pin-out types, it not only gives OEM customers flexibility to choose a suitable solution for their applications but also saves development time. These standards cover electrical and mechanical compatibilities for easy replacement or upgrade, regardless of the mechanical and thermal design. Advantech SOM-6896 Intel USB 3.0 a result, COM is one of the most popular choices for customers to design their application-specific solutions.

COM customers benefit from its flexibility and easy learning curve to serve a variety of applications.

It also defines the PCB thickness to 2mm, onboard component height to less than 8 mm, and the total height from the bottom surface of the PCB module to the standard equipped heat-spreader top surface is 13mm. These mechanical and power specifications make Qseven suitable for small form-factor, mobile or battery target applications.

S9-a1 Stock and Price by Distributor

Qseven uses MXM as a board-to-board connector which is easily obtained and cost effective, along with proven high speed integration for PCI Express. For size-crucial designs, Qseven provides the necessary functionality to minimize design effort for limited Advantech SOM-6896 Intel USB 3.0. ETX board-to-board connectivity is robust enough for rugged conditions and only requires 5V input voltage, for easy system design. These features make ETX a widely adopted platform in many crucial, legacy-interface type applications. We act as your in-house engineer as well as your personal consultant.

We transform complex COM development into easy tasks so our customers can better meet new market challenges. COM Design-in Service 1. Our client reference library makes it simple to implement features on carrier boards, saving overall design and verification efforts. Modularization goes a long way toward achieving these objectives. Easy maintenance and migration Extreme Computing Performance with Low Thermal Design Power High density systems usually have a heat dissipation problem because of limited in-chassis space for a thermal module. Users benefit from a Advantech SOM-6896 Intel USB 3.0 of performance options; they can select just what is appropriate for their lightweight, or scale out workloads.


They planned to upgrade their existing equipment from traditional wired to a wireless solution to avoid chemical corrosion that could affect their wired infrastructure. They needed a reliable data acquisition solution with stable wireless connectivity that supports multiple sensor combinations.

To gather factory environment information, the customer used one edge computer DS wirelessly connected to 35 sets of WISE which do the data acquisition. Advantech co-worked with the customer to integrate all the WISE devices which are used for sensing such conditions as ph values, conductivity, water temperatures and levels.

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  • Advantech COM Express Compact Modules APC Smartwave
  • COM Express Type 6 module runs Linux on 5th Gen Cores
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  • World’s First Server-grade COM Express with 64G Memory Capacity

Through sensor integration, the customer s local control center can easily monitor and control all data around the factory. Easy installation and configuration for MESH wireless network deployment.


The new system serves multiple purposes: These systems also help reduce, or dispatch, frivolous claims. The bus fare collection system also makes more efficient management possible; the system can integrate payment, video surveillance, passenger information, bus tracking, and infotainment. 5th Gen Intel® Core™ / Celeron Processors COM Express Compact Module Type SATA; SPI Bus; USB; USB; GPIO; Watchdog timer; COM Port; Express. SOM User Manual SOM is equipped with the latest 5th generation Advantech SOM-6896 Intel USB 3.0. USB Interface: Supports 2 ports USB, 8 ports USB ▫.

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